What’s in the March Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the March issue.
Czech Semiconductor Centre Launches in Brno, Strengthening Europe’s Chip Autonomy
A new chapter in Europe’s semiconductor independence has begun in Brno with the launch of the Czech Semiconductor Centre (CSC).
From Microelectronics to Microfluidics: How 3D Printing Is Shaping the Future of Tiny Devices
The world of micro and nano devices is undergoing a seismic shift, thanks to the latest advancements in 3D printing technology.
What’s in the March Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the March issue.
Computing Breakthrough Award Goes to Key Figure in Microchip Revolution
UCLA Professor Jason Cong recognized with the ACM Chuck Thacker Award for Improving the Automation and Customizability of Computing Systems.
FormFactor Introduces the EVOLVITY 300 Probe System
Company expands the 300mm product line with new semi-automated system.
Nexperia Introduces New High Speed Optimized Flip-Chip Package Technology
New flip-chip land grid array (FC-LGA) packages deliver superior RF performance and meet automotive quality with industry’s first side-wettable flank versions.
Cyient Announces the Launch of Semiconductor Subsidiary
By carrying forward Cyient’s expertise in semiconductor design, Cyient Semiconductors will focus on scaling Application-Specific Integrated Circuit (ASIC) turnkey solutions for customers.
Omnitron Sensors Appoints Ijaz Jafri as Vice President of Engineering
Dr. Jafri brings a 20+-year track record of successfully bringing disruptive MEMS and semiconductor technologies to market in the automotive, industrial, aerospace, defense and consumer sectors.
Nanomotion Delivers First Prototype for .25 Nanometer Resolution Stage for Semiconductor Metrology
Nanomotion, a provider of advanced motion solutions, announced the successful delivery of its first prototype for a .25nm resolution stage designed for semiconductor metrology applications.
AUO Showcases Diverse Display Solutions Driven by Revolutionary Display Technology at Touch Taiwan
Under the theme “Beyond Vision – Create the Ultimate,” AUO will showcase advanced technology at Touch Taiwan 2025, the annual gala for the display industry, taking place at the Taipei Nangang Exhibition Center April 16-18, 2025.
Hailo Selects Avnet ASIC as Channel Partner for TSMC Silicon Production
Avnet ASIC announced that it has been selected by Hailo, a chipmaker of edge artificial intelligence (AI) processors, as its silicon channel partner for future chips on its product roadmap.
SEALSQ Appoints COO to Spearhead Its North American Operations
SEALSQ Corp, a company that focuses on developing and selling Semiconductors, PKI, and Post-Quantum technology hardware and software products, announced today the appointment of Loïc Hamon as its Chief Operating Officer (COO), as part of the Company’s strategic expansion in the North American market, effective immediately.
Inaugural SEMIEXPO Heartland Event Underscores Midwestern U.S. as a Global Hub for Smart Manufacturing and Smart Mobility
The inaugural SEMIEXPO Heartland event welcomed leaders in smart mobility and smart manufacturing to the Indiana Convention Center to explore opportunities for collaboration across both disciplines.
AMD Completes Acquisition of ZT Systems
AMD today announced the completion of its acquisition of ZT Systems, a provider of AI and general-purpose compute infrastructure for the world’s largest hyperscale providers.
Georgia Tech Launches Tech AI to Accelerate the Real-World Impact of Artificial Intelligence
The announcement marks the start of Tech AI Fest, the Southeast’s leading AI event, bringing together leading academics, industry experts, government figures, and students for three days of creative partnerships and transformative ideas.
Self-Powered Wireless Sensing Fibers for New Wearable Technology
With the rapid development of the Internet of Things (IoT) and smart devices, wearable technology is becoming an important part of people’s lives.
Bosch Establishes Company with the Synthetic Diamond Solutions Provider Element Six
Quantum sensors: partnership to extend innovation leadership.
DuPont Wins Four Edison Awards
DuPont today announced that four of its innovative material technologies were recognized with the prestigious 2025 Edison Awards. Selected from hundreds of nominees, DuPont received two Gold awards, a Silver and a Bronze.
TECHCET Forecasts Strong Expansion in Sputtering Targets
TECHCET projects semiconductor sputtering target revenues to grow near 9% in 2025, reaching $1.45 billion.
Imec Identifies Stable Operating Range for GaN MISHEMTs in RF Power Amplifiers
The findings support GaN-Si’s potential for high reliability 5G+/6G communication systems.
Global Semiconductor Sales Increase 17.1% Year-to-Year in February
Sales hit highest-ever total for month of February; worldwide chip sales decrease 2.9% month-to-month.
Quantinuum Selected by DARPA to Advance to First Stage of Quantum Benchmarking Initiative
Quantinuum has been selected by the Defense Advanced Research Projects Agency (DARPA), a research and development agency of the United States Department of Defense, to participate in the first stage of the agency’s Quantum Benchmarking Initiative (QBI).
European Chips Skills Academy Launches ECS Summer School 2025 to Inspire Future Electronics Talent
The European Chips Skills Academy (ECSA), an EU-funded project coordinated by SEMI Europe, in collaboration with industry partners AENEAS, EPoSS, and INSIDE, has announced the launch of the ECS Summer School 2025.
Twisted Crystals Open Door to Smaller, More Powerful Optical Devices
Researchers develop first-of-its-kind optical sensor that can simultaneously measure wavelength, polarization.
Featured Video
At SEMICON West 2024, Editor-in-Chief Pete Singer caught up with Nordson TEST & INSPECTION’s Carla Furanna who provides some insights into the company’s products for front, middle and backend applications. Products highlighted at the show include WaferSense® semiconductor sensors, Quadra Pro™ Manual X-Ray System (MXI), and Gen 7™ Acoustic Micro Imaging (AMI) system. Additionally, the innovative SpinSAM™ AMI system was unveiled for the first time at the show. The new system delivers industry-leading throughput with unparalleled sensitivity for accurately locating defects in wafer based assemblies.
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Building Fabs in the U.S. vs Taiwan: Twice as Long, Twice as Much
Construction costs in the U.S., compared to Taiwan, are about twice as much (the process equipment costs are similar). “Building a wafer fab in the west costs twice as much and takes twice the time of building it in Taiwan,” Exyte’s Blaschitz said at SEMI’s ISS.
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