MAGAZINE
April/May
What’s in the April/May Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the April/May issue.
First-Quarter Global Semiconductor Sales Increase 15.2% Year-to-Year; March Sales Tick Down 0.6% Month-to-Month
The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors totaled $137.7 billion during the first quarter of 2024, an increase of 15.2% compared to the first quarter of 2023 but 5.7% less than the fourth quarter of 2023.
New Super-Pure Silicon Chip Opens Path to Powerful Quantum Computers
Researchers at the Universities of Melbourne and Manchester have invented a breakthrough technique for manufacturing highly purified silicon that brings powerful quantum computers a big step closer.
What’s in the April/May Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the April/May issue.
GIST Researchers Develop Nanotechnology for Creating Wafer-Scale Nanoparticle Monolayers in Seconds
The nature-inspired scalable nanoparticle transfer technique leads to the quick and efficient creation of mono-layered nanoparticle assemblies.
Power Integrations to Acquire the Assets of Odyssey Semiconductor
Power Integrations today announced an agreement to acquire the assets of Odyssey Semiconductor Technologies (OTCQB: ODII), a developer of vertical gallium-nitride (GaN) transistor technology.
Advanced Energy Introduces Intelligent, Fully Water-Cooled DC Power Supply
Ascent AMS II power supply with embedded IoT software facilitates innovation and increased productivity for industrial thin film deposition processes.
2023 Global Semiconductor Materials Market Revenue Declines From 2022 Record High, SEMI Reports
Global semiconductor materials market revenue in 2023 contracted 8.2% to $66.7 billion from the market record of $72.7 billion set in 2022, SEMI reported today.
Cohu Appoints Karen M. Rapp to its Board of Directors
Cohu, Inc. today announced that Karen M. Rapp has been appointed to the Cohu Board of Directors, effective today.
ASU Supports Microelectronics Development in Panama
Arizona State University continues to expand its efforts to support development of the semiconductor workforce and supply chain on a global scale.
NY CREATES Welcomes Return of Dr. Douglas Grose as Board of Directors Chair
The New York Center for Research, Economic Advancement, Technology, Engineering, and Science (NY CREATES) announced the return of Dr. Douglas A. Grose as the non-profit organization’s appointed Board Chair.
Empower’s New Ultra-low 1pH ESL Silicon Capacitor Tightens Voltage
Empower Semiconductor today unveiled the largest silicon capacitor in its ECAP product family for high frequency decoupling.
Skylo Certifies Sony’s Altair ALT1250 Chipset for its Satellite Network
Sony Semiconductor Israel’s Altair ALT1250 chipset is now certified by Skylo Technologies, ensuring seamless global connectivity across devices.
EFC Joins the Semiconductor Climate Consortium
EFC Gases & Advanced Materials announced its membership in the Semiconductor Climate Consortium (SCC), managed by SEMI.
Demand for NVIDIA’s Blackwell Platform Expected to Boost TSMC’s CoWoS Total Capacity
NVIDIA’s next-gen Blackwell platform, which includes B-series GPUs and integrates NVIDIA’s own Grace Arm CPU in models such as the GB200, represents a significant development.
SemiLink Materials Secures Growth Capital to Advance U.S. Semiconductor Material Supply Chain Buildout
Carica Sustainable Investments announced today a strategic investment to propel the development of SemiLink Materials, a United States-based semiconductor materials manufacturer and distributor serving the domestic semiconductor manufacturing industry.
Larg Weiland of PDF Solutions Wins Si2 Pinnacle Award
Larg Weiland, a technical fellow at PDF Solutions, has been honored with the quarterly Silicon Integration Initiative Pinnacle Award, which is presented for exceptional contributions to Si2’s success as a leading semiconductor research and development joint venture.
Imec.xpand Launches EUR 300M Fund Amid Global Race for Semiconductor Supremacy
Imec.xpand, an independent global venture capital fund, today announced the launch of a new EUR 300 million fund aimed at accelerating the growth of transformative semiconductor and nanotechnology innovations.
Synopsys and Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU
Synopsys, Inc. today announced that Samsung Electronics has achieved successful production tapeout for its high-performance mobile SoC design, including flagship CPUs and GPUs, with 300MHz higher performance using Synopsys.ai full stack AI-driven EDA suite and a broad portfolio of Synopsys IP on Samsung Foundry’s latest Gate-All-Around (GAA) process technologies.
mechatronic systemtechnik GmbH Unveils Technology Center in Fürnitz
mechatronic systemtechnik GmbH (mechatronic), a global supplier of automation equipment for critical wafer handling, announced the opening of its new cutting-edge technology center in Fürnitz.
Semiconductor CMP Pad & Slurry Forecast
CMP consumables for metals to see large growth over next 5 years.
The Flipping Future: Advancements in Flip Chip Packaging
Flip chip technology makes it possible to replace conventional wire interconnections with a direct and strong bond between chips and substrates. The future of silicon packaging is anticipated to be significantly influenced by flip chip technology to satisfy the increasing need for electronics that are faster, smaller, and more efficient.
Intel Takes Next Step Toward Building Scalable Silicon-Based Quantum Processors
Research published in Nature demonstrates high qubit control fidelity and uniformity in single-electron control.
Purdue-Created Technology Makes 3D Microscopes Easier to Use, Less Expensive to Manufacture
3D microscopes are used in applications from the life sciences to semiconductor manufacturing. Now Purdue engineers are developing patented and patent-pending innovations making them work faster to capture even more 3D images and less expensive to manufacture.
Featured Video
Is your semiconductor plant seeking methods to enhance sustainability in wafer manufacturing and water reclamation? The semiconductor sector faces two challenges: waste reduction and water usage. The use of on-line water analytics can assist in overseeing water quality in both wafer manufacturing and reclamation/reuse procedures. This video underscores the significance of monitoring the levels of conductivity, TOC, and microbes to identify impurities that may lead to rejected wafers. Monitoring these parameters also ensures the purity of water to improve wafer quality and yield. Furthermore, this video emphasizes the importance of monitoring the levels of dissolved oxygen, TOC, and pH in waste streams to optimize water recovery.
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U.S. Aims for 20% of World’s Leading Edge Semiconductor Production by 2030
Secretary of Commerce Gina Raimondo believes investments in leading-edge logic chips manufacturing will put the U.S. on track to produce roughly 20 percent of the world’s leading-edge logic chips by the end of the decade.
Water Supply Challenges for the Semiconductor Industry
The energy-hungry nature and large carbon footprint of semiconductor manufacturing have received considerable attention in the context of reducing our emissions of planet-warming greenhouse gases. It turns out we are just as thirsty as we are hungry.
Professors from MIT, UCLA to be Honored for Excellence in Semiconductor Research
The Semiconductor Industry Association (SIA), in collaboration with the Semiconductor Research Corporation (SRC), today announced the winners of its 2019 University Research Awards.
What Do Small Companies Need to Know about the CHIPS Act?
IBM’s Poughkeepsie, N.Y. site was the backdrop for one of President Biden’s speeches promoting the passage of the $52B CHIPS (Creating Helpful Incentives to Produce Semiconductors) and Science Act, a rare piece of legislation for which the president won bipartisan support.
Intel 4 Process Drops Cobalt Interconnect, Goes with Tried and Tested Copper with Cobalt Liner/Cap
At the VLSI Symposia in June, Intel presented a paper “Intel 4 CMOS Technology Featuring Advanced FinFET Transistors Optimized for High Density and High-Performance Computing.” Blogger Dick James reports on details of the interconnect strategy.
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